Coming soon – Truffle Broadband Bonding Routers with up to 10Gbps of bonding capability
Mushroom Networks, Inc., innovators of Broadband Bonding technology, announced (May 2014) a new series of Truffle routers with bonding capacity up to 10 Gbps.
The Truffle E and Truffle EX can be configured for copper or fibre ports and enables Internet bonding that’s 10 times greater than the company’s existing flagship Truffle WAN Virtualisation appliance.
Truffle appliances leverage patented Virtual Leased Line (VLL) and Broadband Bonding technologies to aggregate multiple Internet access lines into one logical IP pipe to connect the branch offices to the head-quarter hub over the bonded tunnels.
Ideal for bonding high speed WAN lines in enterprise, data centre and Internet Service Provider networks, the new Truffle E supports up to 1 Gbps and the new Truffle EX supports up to 10 Gbps bonding capacity.
The aggregation over the Internet access lines is done for every session, providing the full aggregate speed for each flow. Robust in bonding capacity and with high port density, the new series still retains Truffle’s efficient, rack-mountable footprint. Both the E and EX include a number of optional features, such as support for redundant power supply and master/slave redundant High Availability (HA).
The new products are expected to be available at the beginning of the third quarter of this year.